Michael Head, PhD
Software Engineer - Distributed systems, hardware control, applied ML
Engineer of 7+ years. Taught 3D printers new tricks. Now I build software.
Cross-domain: bits, atoms, and everything in between.
• SWE at Axle Energy
• PhD in L-PBF 3D printing
• Hold four land speed world records
• 4 granted/published patents
• Built production systems across hardware, cloud, and data
View My LinkedIn Profile
Projects
WHPSC Race Data Analysis
The World Human Powered Speed Challenge takes place in Nevada each year, and the current world record is 89 mph. In this project I analyse the race data from 2001-2019, creating visualisations for the riders, bikes, and runs.
BEAM-ML: L-PBF Density Prediction API
Build Evaluation for Additive Manufacturing. A service for predicting relative density in Laser Powder Bed Fusion (L-PBF). Combines process parameters with thermophysical properties (NIST + manufacturer data) to deliver a parameter recommender, density sanity checker, and process windows.
Rosenthal Melt Pool Visualiser
Interactive tool for exploring L-PBF melt pool behaviour using the Rosenthal analytical solution. Solve the 3D moving point-source heat equation in real time, rendering isometric melt pool sketches and computing length, width, and depth.
L-PBF Powder Bed Absorptivity Visualiser
Interactive tool for exploring absorptivity of a powder bed in L-PBF. Adjust laser, material, and powder parameters with sliders and see how surface and effective powder bed absorptivity respond in real time.
In-Process Surface Finishing of L-PBF Produced Parts
Developed a novel in-situ surface finishing process for laser-based metal 3D printing, achieving 85% improvement in surface quality (~2 μm roughness) and 12x better dimensional accuracy (±0.01mm) than conventional systems.
Hardware Interface Libraries
CIMSII Midas Ink Control
Python library for controlling a CIMS-II Midas ink recirculation system.
Binder Jet Image Format Convertor
Convert between binder jet image formats, with presets for common controllers.
Patents
Semiconductor package produced by 3D printing (Granted)
A 3D-printing technique for building advanced semiconductor packages with better cooling and electrical performance.
Method of ink jetting to influence a microstructure (Granted)
A 3D printing process that mixes different inks as they're deposited, enabling control over microstructure and material properties in the finished product.
Additive manufacturing using binder jetting (Published)
A 3D printing technique that precisely controls material interfaces in 3D printed parts, enabling multi-material components with tailored properties and designed-in recycling capabilities.
Package produced by binder jet 3D printing (Published)
A binder jetting technique that uses different ink formulations on the same metal powder layer to selectively create electrical conductors and insulators, enabling customisable semiconductor packages with optimised electrical routing and thermal management.